MARKETS AND STRATEGIES FOR CHEMICAL AND MATERIAL SUPPLIERS IN NICHE MARKETS

Chapter 1 Introduction 1-1

Chapter 2 Solar 2-1

2.1 Introduction 2-1
2.2 Crystalline and Polycrystalline Cell Manufacturing 2-4
2.2.1 Silicon Growing and Wafering 2-4
2.2.2 Etching and Texturig 2-7
2.2.3 Anti-Reflection Coatings 2-8
2.3 Thin Film Cell Manufacturing 2-8
2.3.1 Amorphous Silicon Deposition 2-8
2.3.2 Microcrystalline Silicon Deposition 2-10
2.3.3 CdTe – Cadmium Telluride Deposition 2-11
2.3.4 CIGS - Copper Indium Gallium Selenide Deposition 2-14
2.3.5 GaAs – Gallium Arsenide 2-21
2.4 Markets for Materials Suppliers 2-24
2.4.1 Crystalline and Polycrystalline Cell Forecast 2-24
2.4.2 Thin Film Cell Forecast 2-28
2.4.3 Chemicals and Materials Forecast 2-33
2.5 Nanomaterials As Solar Conversion 2-43
2.5.1 Inorganic Nanocrystals 2-46
2.5.2 CdSe And CdTe Nanorods 2-50
2.5.3 Quantum Dots 2-52
2.5.4 Nanocomposite – Quantum Dot Combination 2-53
2.5.5 Quantum Wells 2-54
2.5.6 Organic Polymers – Fullerenes 2-55
2.5.7 Ionic Organic Polymers 2-57
2.5.8 CIGS 2-57
2.5.9 Dye-Sensitized Solar Cells 2-60
2.5.10 Analysis Of Nanomaterial Markets For Solar Cells 2-63

Chapter 3 MEMs 3-1

3.1 The MEMS Market Infrastructure 3-1
3.2 Forecast Of The Key Applications And Markets 3-3
3.2.1 MEMS Device Market Forecast 3-3
3.2.2 MEMS System Market Forecast 3-15
3.3.2 Markets for Materials Suppliers 3-18

Chapter 4 HB-LEDs 4-1

4.1 Recent Progress in High Brightness LED Technology and Applications 4-1
4.2 Materials of Construction 4-10
4.2.1 Phosphor 4-10
4.2.2 Substrate 4-16
4.3 OLED Manufacturing 4-24
4.4 Outlook for the Worldwide OLED Market 4-31
4.5 Outlook for the Worldwide HB-LED Market 4-35

Chapter 5 Thin Film Read/Write Heads for HDD 5-1

5.1 Trends in HDDs 5-1
5.2 Recording Head Market Forecast 5-9
5.3 Head Processing 5-12
5.4 Head Fabrication – 5-17
5.5 Deposition Challenges 5-20
5.6 CMP Challenges 5-21
5.7 CMP Slurry Market 5-28
5.7.1 Ceria Slurry For Glass Disk Market 5-28
5.7.2 Oxide Slurry For Metal Disk Market 5-33
5.7.3 Oxide Slurry For Thin Film Head Market 5-36

Chapter 6 Wafer Level Processing (WLP) 6-1

6.1 Introduction 6-1
6.2 Flip Chip/WLP Processing Issues and Trends 6-2
6.2.1 Wafer Bumping 6-2
6.2.2 Wafer Level Packaging 6-6
6.2.3 Pad Redistribution 6-10
6.2.4 Wafer Bumping Costs 6-16
6.3 Metallization Issues and Trends 6-18
6.3.1 Gold Bumping Metallization 6-18
6.3.2 Solder Bumping Metallization 6-19
6.4 UBM Etch Issues And Trends 6-22
6.4.1 Etch Process 6-22
6.4.2 Etch Chemistry 6-24
6.5 Analysis of WLP Market 6-26

List of Figures

2.1 Diagram Of Solar Cell 2-2
2.2 Cross Section Of A Solar Cell Under Illumination 2-3
2.3 Polysilicon Manufacturing And Supply Chain 2-6
2.4 Cross-Sectional Schematic Diagram Of The InGaP/InGaAs/Ge ATJ Cell 2-23
2.5 Percentage Gas Costs For Amorphous Silicon Solar Cell 2-42
3.1 MEMs Chemicals Forecast 3-20
3.2 MEMs Photomasks Forecast 3-23
3.3 MEMs Substrate Forecast 3-25
3.4 Forecast of MEMs Wafer Size 3-28
4.1 Operation of LED 4-2
4.2 Market drivers for LED Biz and Applications 4-6
4.3 SSL vs. Classical Technologies 4-7
4.4 LED Performance vs. Traditional Light Sources 4-8
4.5 Regular LED (white) Front-End Steps 4-12
4.6 Packaged LED Cost Basis - 2009 4-14
4.7 Packaged LED Cost Basis - 2013 4-15
4.8 Regular LED (White) Production Costs For 100k Wafers/Year 4-17
4.9 HB LED (White) Production Costs For 100k Wafers/Year 4-18
4.10 LED Cost Model: Impact Of Substrate Choice 4-19
4.11 Main Manufacturing Steps For GaN-Based Led 4-21
4.12 Schematic Of AMOLED 4-32
4-13 Active Matrix OLED Capacity And Demand Forecast 4-33
5.1 Hard Disk Drive Roadmap 5-2
5.2 Decrease In Average Price Of Storage 5-3
5.3 Heads Per Drive 5-5
5.4 Market Forecast Of Recording Head Consumption 5-10
5.5 Heads Per Drive Forecast 5-11
5.6 Thin Film Head Structure 5-13
5.7 Critical Features In Thin Film Head Structure 5-14
5.8 Spin Valve Head Structure 5-15
5.9 Cross-Sectional View TFH Stacks 5-18
5.10 Cross-Sectional View Of A TFH Design 5-19
5.11 CMP Slurry System For TFH Wafer Polishing 5-26
5-12 Total Slurry Consumption For HDD Forecast 5-38
6.1 Solder Bumping Process 6-4
6.2 Pillar-WLP CSP Process 6-11
6.3 Pad Redistribution Process 6-14

List of Tables

2.1 Historic Solar Cell Production By Region 2-25
2.2 Solar Cell Forecast 2-27
2.3 Market Share Of Solar Cells By Technology 2-29
2.4 Cost Comparison Of Thin Film Technologies 2-32
2.5 Polysilicon Production Capacities By Company 2-34
2.6 Affect Of Substrate Material On Cigs Solar Efficiency 2-37
2.7 Forecast Of Transparent Electrodes For Photovoltaics 2-39
2.8 Solar Materials Forecast – Crystalline Silicon Cells 2-41
3.1 MEMS Device Market Forecast 3-4
3.2 MEMS System Markets Forecast 3-17
4.1 Color, Wavelength Material Of LED 4-3
4.2 Comparison of LED, HB-LED, UHB-LED Characteristics 4-9
4.3 Production Method for Various LEDs 4-11
4.4 Comparison Of $/Klm For LED Made On Various 2" Susbtrates 4-20
4.5 Forecast Of Sapphire Substrate Size Distribution By Area 4-22
4.6 Sapphire Substrate Market Forecast 4-23
4-7 Projected Costs Of OLED Lighting Panels (Sheet Processed) Stage 4-28
4-8 Projected Costs Of OLED Lighting Panels (Web Processed) Stage 4-29
4.9 Global LED Market Forecast 4-44
5.1 Slurry And Abrasive Suppliers And Products 5-30
5.2 Worldwide Ceria Slurry For Glass Media Market Forecast 5-32
5.3 Worldwide Oxide Slurry For Metal Market Forecast 5-35
5.4 Worldwide Oxide Slurry For Thin Film Heads Market Forecast 5-37
6.1 Common UBM Stacks For Solder And Gold Bumping 6-3
6.2 Solder Bumping Guidelines 6-5
6.3 ITRS Pin Counts For Different Applications 6-7
6.4 Pillar-WLP CSP Guidelines 6-12
6.5 Pad Redistribution Guidelines 6-15
6.6 Common UBM Stacks For Gold And Solder Bumping 6-19
6.7 UBM Film Etchants 6-25
6.8 WLP Demand By Device (Units) 6-27
6.9 WLP Demand By Device (Wafers) 6-28